Saturday, March 27, 1858.Lincoln, IL and
Springfield, IL.
| Lincoln and Goodrich represent defendants in
Bruner et al. v. Bruner et al., bill to
correct mortgage deed. Report submitted is approved and ordered recorded.
Record. In Springfield, Lincoln finds among
his mail letter from Jonathan Haines of Pekin, client in reaper patent
litigation, and one from Alfred Hyde, convict. He writes to Haines about two
law suits, one pending, another prospective. "I really can not find time to
prepare such a suit, until the Spring courts are over." Abraham Lincoln to Jonathan Haines,
27 March 1858, CW, 2:436-37. Hyde reminds Lincoln of seeing him on train March 4, 1857, and asks his
assistance in seeking pardon. Lincoln files Hyde's letter until Aug., when he
writes Daniel Dickinson of New York about him. Hyde to
Lincoln, 25 March 1858, Abraham Lincoln Papers, Library of Congress,
Washington, DC;
Abraham Lincoln to Daniel S.
Dickinson, 3 August 1858, CW,
2:535. |